Donal Behal has been appointed as the new fulltime project manager in the PIXAPP Pilot Line Gateway. Donal will take responsibility for helping to manage interactions with Gateway users and with the EU Commission. Donal brings considerable experience to the position, having managed Tyndall’s financial and reporting activities to the EU Commission for the past number of years. He also worked in a number of industry roles, including financial management and project reporting. Donal is qualified in Business Management & Administration, with specialisation in project planning, which will be a valuable asset to Gateway operations. We wish him the best in this exciting role.
Prof. Peter O'Brien presenting the European Photonic Pilot Lines at the Integrated Photonics Roadmapping Session at the OFC
PIXAPP is pleased to announce that Prof. Peter O’Brien (Director of the PIXAPP Pilot Line) will give an invited talk at the workshop on International Photonic System Roadmaps at OFC (www.ofcconference.org/en-us/home/exhibit-hall/show-floor-programming/international-photonic-systems-roadmaps)
PIXAPP is pleased to announce that Prof. Peter O’Brien (Director of the PIXAPP Pilot Line) will be Chair of the OIDA Workshop on Manufacturing Trends for Integrated Photonics, to be held at the Optical Fiber Conference (OFC), Los Angles, on 19th of March (www.osa.org/en-us/meetings/global_calendar/events/workshop_on_manufacturing_trends_for_integrated_ph)
Dr. Lee Carroll (Technology Manager of the PIXAPP Pilot Line) will give an invited talk Introducing the technical capabilities of the new Packaging and Assembly Pilot Line at the EPIC workshop on PIC Testing in Pisa (Italy) on 16-17 of February. (www.epic-assoc.com/testing-workshop-in-pisa)
PIXAPP is pleased to announce that Prof. Peter O’Brien (Director of the PIXAPP Pilot Line) will give an Invited Talk about the new Photonic Packaging Pilot Line at the PIC International Conference in Brussels, March 7-8th (www.picinternational.net)
PIXAPP targets four key Application Demonstrators, one of which is a Si-PIC DataComm module with hybrid integrated electronics and lasers, as well as a pluggable multi-channel single-mode Fibre-to-PIC connection.
A group photo of the PIXAPP partners in UCC (University College Cork) during the PIXAPP Kick-Off Meeting in Ireland from 19-20th of January 2016. PIXAPP consists of 18 partners from companies and institutes in Europe.
PIXAPP - the world's first open-access pilot-line for the assembly and packaging of PICs (Photonic Integrated Circuits) - had its kick-off meeting on the 19th of January 2016, at the Tyndall National Institute in Cork, Ireland. PIXAPP's European partners, from Ireland, Belgium, the Czech Republic, Finland, France, Germany, Italy, the Netherlands, and the United Kingdom, all travelled to Cork, to participate in the two day event.
For more information, or to get in touch with the Gateway, please contact us.