PIXAPP at OFC 2024

Meet us at OFC in San Diego, where Prof. Peter O’Brien will be giving Short Course SC525 entitled “Photonic and Electronic Packaging – Materials, Processes, Equipment and Reliability”  (Monday 25th March). Check details on the OFC website for registration.

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PIXAPP at PIC Summit Europe 2023

PIXAPP Director, Prof Peter O’Brien, will be speaking at the PIC Summit Europe 2023. On 7th of November I’ll will give more insights on Heterogeneous Integration. Future PIC-based systems will require an indium phosphide based laser and a bunch of silicon transistors. This will likely be integrated on a silicon substrate. Technologies and materials will […]

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PIXAPP at ECOC 2023

PIXAPP, in partnership with AIM Photonics, will hold a Special Session on PIC packaging and integration at ECOC 2023, in Glasgow on October 5th 2023. This workshop brings together leading industry and academic speakers who will present their vision on how to address existing and emerging packaging challenges. Speakers will address topics including packaging materials, […]

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PIXAPP at OFC 2023

Meet PIXAPP’s Director at OFC in San Diego in March 2023. Prof. Peter O’Brien will be presenting at Quantum Computing workshop (Sunday 5th) and giving Short Course SC450 in Photonics Manufacturing (Monday 6th)

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PIXAPP hosts EMVF 2022 in Cork

PIXAPP co-organized with the European Machine Vision Association, the 5th European Machine Vision Forum  at the end of October in Cork. It brought together industry and academic machine vision experts in a unique setting. The aim of the forum is to foster interaction between the machine vision industry and academic research to learn from each […]

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PIXAPP at ECOC 2022

PIXAPP, in partnership with PhotonHub Europe and the JEPPIX and ePIXfab pilot lines organised a training course on Integrated Photonic Technologies at ECOC 2022, in Basel, on September 20th 2022. More information on the training, here.

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PIXAPP at Meeting on Automated Packaging & Testing of Photonic Integrated Circuits

PIXAPP’s Managing Director, Peter O’Brien, will present at the EPIC Online Technology Meeting on Automated Packaging & Testing of Photonic Integrated Circuits on 4 October at 15:00 CEST. In this meeting, key players in the packaging field will discuss the adoption of standards, packaging requirements for new applications and the development of faster and cost-effective […]

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PIXAPP at Meeting on Head-Up Displays: from 2D to AR

The development of systems for augmented reality visualisation brings a number of photonic challenges to the table. PIXAPP will participate at the EPIC Online Technology Meeting on Head-Up Displays: from 2D to AR to identify the role of integrated circuits in these systems and which are the processes for packaging and assembly involved. Join us […]

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PIXAPP at ECOC Exhibition 2021

PIXAPP will be exhibiting at ECOC Exhibition, from 13 to 15 September 2021, in Bordeaux, France. ECOC Exhibition is a key meeting place for decision-makers from across the fibre optic communications technology industry. Visit us at booth #1110 in hall 1, to know more about the high-speed gold box offered by the PIXAPP Pilot Packaging Platform, […]

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